发明名称 |
Method of separating layers of material |
摘要 |
A lift off process is used to separate a layer of material from a substrate by irradiating an interface between the layer of material and the substrate. According to one exemplary process, the layer is separated into a plurality of sections corresponding to dies on the substrate and a homogeneous beam spot is shaped to cover an integer number of the sections. |
申请公布号 |
US2006003553(A1) |
申请公布日期 |
2006.01.05 |
申请号 |
US20050215248 |
申请日期 |
2005.08.30 |
申请人 |
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发明人 |
PARK JONGKOOK;SERCEL JEFFREY P.;SERCEL PATRICK J. |
分类号 |
H01L21/301;H01L21/268;H01L21/30;H01L21/46;H01L21/78;H01L29/22;H01L33/00 |
主分类号 |
H01L21/301 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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