| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition molding material for encapsulation excellent in moldability such as fluidity, flame resistance, heat resistance and thermal cycle resistance and an electronic component device equipped with an element encapsulated with the epoxy resin composition molding material. SOLUTION: The epoxy resin composition molding material for encapsulation contains (A) an epoxy resin containing an epoxy resin obtained by glycidyl etherification of a dimer of at least either of hydroxynaphthalene and dihydroxynaphthalene, (B) a hardener expressed by general formula (I) (wherein, n is 0 or a positive integer; and a hydrogen atom on the benzene ring and the naphthalene ring in A and B may be substituted with a hydrocarbon group) and (C) an inorganic filler. Component (C) has at least an average particle size of≥15μm or a specific surface area of≤4.5 m<SP>2</SP>/g. COPYRIGHT: (C)2006,JPO&NCIPI
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