| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a package for a semiconductor apparatus which can suppress the tilt of the three dimensional direction easily and can realize high precision packaging in packaging of a semiconductor device using the package, and to provide a semiconductor apparatus using it and its manufacturing method. <P>SOLUTION: A principal plane which curves in the protruding shape of the substrate of a package body 2 or a packaging part is not made flat. Conversely, the principal plane is selectively formed in the shape of a recess 21 and the package is manufactured with a configuration controlled in a predetermined depth. With this configuration, the surrounding top side of the recess 21 can hold a semiconductor device rear face stably by a plurality of positions. As a result, the semiconductor apparatus of high precision packaging suppressing tilt can be realized. In this way, a sintering ceramic stacked package has structurally large curvature. Accordingly, the problem is solved that the tilt was produced due to a fault of packaging precision (especially, the tilt) caused by warpage. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
