发明名称 Highly compliant plate for wafer bonding
摘要 The present invention discloses a method that includes: providing two wafers; forming raised contacts on the two wafers; aligning the two wafers; bringing together the raised contacts; locally deflecting the two wafers; and bonding the raised contacts. The present invention also discloses a bonded-wafer structure that includes: a first wafer, the first wafer being locally deflected, the first wafer including a first raised contact; and a second wafer, the second wafer being locally deflected, the second wafer including a second raised contact, wherein the second raised contact is bonded to the first raised contact.
申请公布号 US2006003548(A1) 申请公布日期 2006.01.05
申请号 US20040898400 申请日期 2004.07.23
申请人 KOBRINSKY MAURO J;RAMANATHAN SHRIRAM;LIST SCOTT 发明人 KOBRINSKY MAURO J.;RAMANATHAN SHRIRAM;LIST SCOTT
分类号 H01L21/30 主分类号 H01L21/30
代理机构 代理人
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