| 摘要 |
A packaged microelectronic element includes connection component incorporating a dielectric layer ( 22 ) carrying traces ( 58 ) remote from an outer surface ( 26 ), posts ( 48 ) extending from the traces and projecting beyond the outer surface of the dielectric, and pads ( 30 ) exposed at the outer surface of the dielectric layer, the pads being connected to the posts by the traces. The dielectric element overlies the front surface of a microelectronic element, and contacts ( 74 ) exposed on the front surface of the microelectronic element are connected to the pads by elongated leads ( 76 ) such as wire bonds. Methods of making the connection component are also disclosed.
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