发明名称 Systems and methods for a target and backing plate assembly
摘要 A target ( 1 ) and backing plate ( 10 ) assembly and method of making the same. The target ( 1 ) and backing plate ( 10 ) assembly provides a mechanical interlock between the target ( 1 ) and backing plate ( 10 ) in addition to diffusion bonding between dissimilar materials comprising the target ( 1 ) and backing plate ( 10 ). An interlayer may also be used between the target ( 1 ) and backing plate ( 10 ). A plurality of ridges, or other salient surface features ( 3,4 ) on one of the target ( 1 ) and backing plate ( 10 ) are joined to corresponding members or channels ( 13, 14 ) on the other of the target and backing plate. The dissimilar materials of the target ( 1 ) and backing plate ( 10 ) fill negative angled cavities ( 13, 14 ) formed by the plurality of ridges ( 3, 4 ) and corresponding channels or members ( 13, 14 ) of the target ( 1 ) and backing plate ( 10 ) to accommodate the diffusion bonded dissimilar materials. A target ( 1 ) and backing plate ( 10 ) assembly with increased strength results.
申请公布号 US2005284746(A1) 申请公布日期 2005.12.29
申请号 US20050526704 申请日期 2005.07.19
申请人 TOSOH SMD, INC. 发明人 IVANOV EUGENE Y.
分类号 C23C14/00;C23C14/32;C23C14/34;(IPC1-7):C23C14/00 主分类号 C23C14/00
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