| 发明名称 |
System for different bond pads in an integrated circuit package |
| 摘要 |
<p>An integrated circuit package is provided with a substrate having first and second contact pads exposed through a passivation layer on the substrate. A first metallurgy layer is over the substrate. A second metallurgy layer is over the first metallurgy layer. A protective layer is over the first contact pad.</p> |
| 申请公布号 |
SG117569(A1) |
申请公布日期 |
2005.12.29 |
| 申请号 |
SG20050002905 |
申请日期 |
2005.05.09 |
| 申请人 |
STATS CHIPPAC LTD |
发明人 |
LUN ZHAO;WAN LAY LOOI;KYAW OO AUNG;YONGGANG JIN;JAE-YONG SONG;WON SUN SHIN |
| 分类号 |
H01L21/44;H01L21/60;H01L23/48;H01L23/485 |
主分类号 |
H01L21/44 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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