发明名称 |
Semiconductor device and method of manufacturing the same |
摘要 |
A semiconductor device according to an embodiment of the present invention includes a plurality of chip regions and a plurality of chip rings. The plurality of chip regions include semiconductor integrated circuits each having a multilayered wiring structure using a metal wiring, and are formed into independent chips. The plurality of chip rings has the multilayered wiring structure using the metal wiring, and surround the respective chip regions. The plurality of chip rings are electrically connected to one another.
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申请公布号 |
US2005285229(A1) |
申请公布日期 |
2005.12.29 |
申请号 |
US20050117726 |
申请日期 |
2005.04.29 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
HIGASHI KAZUYUKI;MATSUNAGA NORIAKI |
分类号 |
H01L21/288;H01L21/46;H01L21/768;H01L23/52;H01L23/532;H01L23/58;(IPC1-7):H01L23/52 |
主分类号 |
H01L21/288 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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