| 摘要 |
An IC socket includes a pressurizing head provided on a counter weight to be movable in at least an approximately vertical direction over a package containing member. The counter weight is pivotally mounted around a shaft, which acts as a fulcrum, situated at the end opposite to a slide member and operated by pivotally rotating around the shaft. A cover fixing member and a ball contacting platform are provided on the lower face of the counter weight close to the end opposite to that provided with the shaft. When the ball contacting platform is situated at the location as designated with solid lines, a ball member on the counter weight is held by an upper portion of the ball contacting platform so as to hold the semiconductor device in the package containing member in a spatially separated position from a tip of pressurizing head. In addition, when the ball contacting platform is displaced by sliding movement to the location as designated with chain double-dashed lines, the vertical location of the ball member and the pressurizing head is gradually lowered. The application of a predetermined magnitude of pressuring force of the semiconductor device, therefore, becomes feasible.
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