| 发明名称 |
Apparatus and method for mechanical coupling of land grid array applications |
| 摘要 |
A land grid array (LGA) assembly includes a chip carrier substrate having at least one chip attached thereto, and a stiffener member attached to the chip carrier substrate, the stiffener member further including a honeycomb material. A cap is attached to the chip and stiffener member.
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| 申请公布号 |
US6979782(B1) |
申请公布日期 |
2005.12.27 |
| 申请号 |
US20050908353 |
申请日期 |
2005.05.09 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BRODSKY WILLIAM L.;QUESTAD DAVID L. |
| 分类号 |
H01L21/48;H01L23/02;H01L23/13;H01L23/498;(IPC1-7):H01L23/02 |
主分类号 |
H01L21/48 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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