Strained silicon-on-silicon by wafer bonding and layer transfer

摘要

A semiconductor-based structure includes first and second layers bonded directly to each other at an interface. Parallel to the interface, the lattice spacing of the second layer is different than the lattice spacing of the first layer. The first and second layers are each formed of essentially the same semiconductor. A method for making a semiconductor-based structure includes providing first and second layers that are formed of essentially the same semiconductor. The first and second layers have, respectively, first and second surfaces. The second layer has a different lattice spacing parallel to the second surface than the lattice spacing of the first layer parallel to the first surface. The method includes contacting the first and second surfaces, and annealing to promote direct atomic bonding between the first and second layers.