发明名称 Wire form heat sink retention module
摘要 A retention module firmly secures a heat sink for a computer chip. The retention module is oriented about the computer chip on a circuit board. The retention module has a rotatable wire form that has two loops. When the rotatable wire form is rotated, the two loops press against an impingement shelf on the heat sink, forcing the heat sink against the retention module and the computer chip. The two loops are angularly offset to each other, thus compensating for torsion lag between the two loops when the two loops are pressed against the impingement shelf.
申请公布号 US2005280999(A1) 申请公布日期 2005.12.22
申请号 US20040871661 申请日期 2004.06.18
申请人 INTERNATIONAL BUSINESS MACHINES CORP. 发明人 FARROW TIMOTHY S.;HERRING DEAN F.;MARTIN-OTTO WILLIAM F.
分类号 H01L23/40;H05K7/20;(IPC1-7):H05K7/20 主分类号 H01L23/40
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