发明名称 |
MULTILAYER WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
<p>In a multilayer wiring board, on an insulating board (10), an arbitrarily formed first conductivity type pattern (12), an insulating material layer (16A) and a second conductivity type pattern (20) formed by applying a conductive material in a pattern on a region corresponding to a graft polymer pattern (18) formed on the insulating material layer are subsequently provided. The multilayer wiring board is provided with a conductive path (22) which electrically connects the first conductivity type pattern and the second conductivity type pattern existing on the insulating substrate. The graft polymer pattern consists of a region wherein a graft polymer exists and a region wherein the graft polymer does not exist, or it consists of a region wherein a hydrophilic graft polymer exists and a region wherein the hydrophobic graft polymer does not exist.</p> |
申请公布号 |
WO2005120142(A1) |
申请公布日期 |
2005.12.15 |
申请号 |
WO2005JP09915 |
申请日期 |
2005.05.31 |
申请人 |
FUJI PHOTO FILM CO., LTD.;KAWAMURA, KOICHI;KANO, TAKEYOSHI |
发明人 |
KAWAMURA, KOICHI;KANO, TAKEYOSHI |
分类号 |
H05K3/38;H05K3/46;(IPC1-7):H05K3/46 |
主分类号 |
H05K3/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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