| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method wherein a semiconductor device is manufactured with a higher speed and efficiency by enabling the manufacture of a small semiconductor device in a short time and at a relatively low cost, and to provide an apparatus therefor. SOLUTION: The semiconductor device manufacturing method utilizes a workpiece segmentation stage, and includes a step 1004 wherein one or more workpieces are bonded and fixed to a rectangular adhesive tape conformal to the contours of the one or more workpieces, and a step for sucking the adhesive tape with the workpieces bonded thereto or the workpieces bonded to the adhesive tape in the step 1004, and for transporting to the workpiece segmentation stage. COPYRIGHT: (C)2006,JPO&NCIPI |
