发明名称 |
Semiconductor device |
摘要 |
In a semiconductor device, bonding-wires can be applied parallel to each other to electrodes of high-speed signal lines when mounting a highly densified semiconductor element on a low-cost substrate while reducing a length of the bonding-wires. An impedance-matched substrate having wiring that impedance-matched with circuits of a semiconductor element is mounted on a substrate. A plurality of first metal wires connect between first electrodes of the semiconductor element and electrodes of the substrate. A plurality of second metal wires connect between second electrodes of the semiconductor element and first electrodes of the impedance-matched substrate. A plurality of third metal wires connect between second electrodes of the impedance-matched substrate and electrodes of the substrate. The second metal wires extend parallel to each other, and the third metal wires also extend parallel to each other.
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申请公布号 |
US2005269701(A1) |
申请公布日期 |
2005.12.08 |
申请号 |
US20040971692 |
申请日期 |
2004.10.25 |
申请人 |
TSUJI KAZUTO;KUBOTA YOSHIHIRO;ASADA KENJI;HOSOYAMADA SUMIKAZU |
发明人 |
TSUJI KAZUTO;KUBOTA YOSHIHIRO;ASADA KENJI;HOSOYAMADA SUMIKAZU |
分类号 |
H01L23/12;H01L21/60;H01L21/607;H01L23/48;H01L23/552;H01L23/66;(IPC1-7):H01L31/032 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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