SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device which can have its build made small-sized while reducing wiring resistance and whose processing time can be shortened.

SOLUTION: The semiconductor device 100 is equipped with an IC chip 10 which has an electrode 11 on one surface, an insulating substrate 21; a wiring pattern 22 formed on the insulating substrate 21; and a circuit board 20 which includes the wiring pattern 22 as its bottom and is formed of a 1st via hole 24 filled with a 1st connection material 23. The semiconductor also has the electrode 11 and wiring pattern 22 electrically connected to each other through the 1st connection material 23 while the IC chip 10 is mounted on the circuit board 20. The wiring pattern 22 is provided thicker than the electrode 11.

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