| 摘要 |
PROBLEM TO BE SOLVED: To have no harmful effect on a wafer and a device by preventing micro vibration of a grinding wheel caused by impact force and grinding resistance when starting to grind with the grinding wheel, from being transmitted to the wafer in the case of grinding the wafer using the grinding wheel. SOLUTION: A cushioning material 220 is interposed between a wheel mount 210 and a wheel base 230a, and the wafer W1 is held on the chuck table 14a. The chuck table 14a is rotated to rotate the wafer W1, and the wheel mount 210 is rotated and fed for grinding to bring a grinding wheel part 230b of the grinding wheel 230 into contact with the wafer W1 to perform grinding. Impact force when the grinding wheel part 230b and the wafer W1 come in contact, and the micro vibration of the grinding wheel part 230b caused by grinding resistance, are absorbed by the cushioning material 220. A phenomenon causing grinding distortion such as a crack on a ground surface W1b is thereby suppressed to prevent a lowering of anti-bending strength of the device. COPYRIGHT: (C)2006,JPO&NCIPI |
