| 摘要 |
PROBLEM TO BE SOLVED: To provide a sub-mount on which a plurality of electronic components can be connected and mounted electrically excellently while being accurately positioned relatively to each other, and a light emitting apparatus using the sub-mount. SOLUTION: A sub-mount comprises a wiring layer 2 configured by sequentially laminating, on the upper surface of an insulating substrate 1, a tight metal layer 2a, a first diffusion preventive layer 2b and a main conductor layer 2c comprised of Au, and a plurality of mounting parts which are configured by laminating a wax layer 4 on an upper surface of the wiring layer 2 and on which electronic components 5 are electrically connected and mounted. There are mixed the plurality of mounting parts configured by laminating the wax layer 4 comprised of Au-Sn alloy on the upper surface of the wiring layer 2, and the wax layer 4 comprised of Au-Sn alloy via a second diffusion preventive layer 3 comprised of Pt on the upper surface of the wiring layer 2. By fusing the wax layer 4, a composition ratio of the Au-Sn alloy changes and a difference occurs in fusing temperatures, so that the plurality of electronic components 5 can be strongly brazed together. COPYRIGHT: (C)2006,JPO&NCIPI
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