| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition having excellent heat resistance, and capable of providing a laminate having small coefficient of linear expansion, and good adhesiveness to a conductor circuit; and to provide a prepreg and a laminate using the composition. SOLUTION: The resin composition, usable for forming a sheet-shaped prepreg by impregnating a base material therewith contains an epoxy resin containing a dicyclopentadiene-type epoxy resin, and a triazine-modified novolak resin. The prepreg is obtained by impregnating the base material with the resin composition. The laminate is obtained by forming one or more sheets of the prepreg. COPYRIGHT: (C)2006,JPO&NCIPI |
