| 摘要 |
PROBLEM TO BE SOLVED: To obtain a resin composition having sufficient low stress properties even in use for application of large-area adhesion and exhibiting excellent adhesiveness, and to provide a semiconductor apparatus having excellent reliability by using the resin composition as a die attach material or a heat sink attach material for a semiconductor. SOLUTION: The resin composition comprises a compound (A) containing at least one functional group represented by formula (1) (R<SB>1</SB>is C<SB>2</SB>H<SB>2</SB>or C<SB>3</SB>H<SB>4</SB>) and a structure represented by formula (2) -ZX(YX)<SB>n</SB>Z- (2) (X is R<SP>2</SP>-Si-(CH<SB>3</SB>)<SB>2</SB>-OSi-(CH<SB>3</SB>)<SB>2</SB>-R<SP>2</SP>; R<SP>2</SP>is a 1-10C hydrocarbon group; Z is NHCO; (n) is an integer of 1-50; Y represented in formula (2) has a structure represented by formula (3) (R<SP>3</SP>is an organic group)). COPYRIGHT: (C)2006,JPO&NCIPI |
