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发明名称
一种配线基板及其形成的方法
摘要
本发明提供一配线基板,该配线基板包括一基板;以及一铜配线层,该铜配线层配置于该基板上方,其中该铜配线层为铜或以铜为主要成分;一扩散抑制层,该扩散抑制层配置于该铜配线层上且其中该扩散抑制层为含氮之金属层,同时,提供制备此配线基板之制造方法。
申请公布号
TW200538800
申请公布日期
2005.12.01
申请号
TW094102407
申请日期
2005.01.26
申请人
奇美电子股份有限公司
发明人
吉村裕介;藤本聪和;荒井俊明
分类号
G02F1/133
主分类号
G02F1/133
代理机构
代理人
主权项
地址
台南县新市乡台南科学工业园区奇业路1号
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