| 摘要 |
Exemplary embodiments of the invention provide a piezoelectric oscillator that enables reduction in thickness. A piezoelectric oscillator is configured to include: an electronic component electrically connected with one side face of a plurality of leads that are formed from a lead frame, a mold material that seals the electronic component such that the other side face of the plurality of leads is exposed, and a piezoelectric resonator element bonded to the other side face of the plurality of leads via a conductive material. Namely, a connection terminal is formed in the other side face of the plurality of leads. Moreover, the lead protruding from the mold material is bent downwards to form a mounting terminal.
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