发明名称 |
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME |
摘要 |
<p>A SEMICONDUCTOR DEVICE HAS (A) A SEMICONDUCTOR COMPONENT (6); (B) A CIRCUIT SUBSTRATE (8; 14); (C) A BASE MATERIAL (1; 12) WHICH IS PLACED BETWEEN THE SEMICONDUCTOR COMPONENT AND THE CIRCUIT SUBSTRATE; AND (D) A CONDUCTIVE PASTE (5), WHICH IS FILLED INTO A HOLE (4) FORMED IN THE BASE MATERIAL, FOR ELECTRICALLY CONNECTING BETWEEN A TERMINAL ELECTRODE (7) OF THE SEMICONDUCTOR COMPONENT AND AN INTERNAL CONNECTION ELECTRODE (9) OF THE CIRCUIT SUBSTRATE.</p> |
申请公布号 |
MY120575(A) |
申请公布日期 |
2005.11.30 |
申请号 |
MY1999PI02246 |
申请日期 |
1999.06.03 |
申请人 |
PANASONIC CORPORATION |
发明人 |
YOSHIHIRO BESSHO;MINEHIRO ITAGAKI |
分类号 |
H01L21/603;H01L21/56;H01L21/60;H01L23/498 |
主分类号 |
H01L21/603 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|