| 摘要 |
A printed circuit board supporting structure includes a printed circuit board, a board support constituted by a conductor, and a clamping device that clamps and fixes the printed circuit board to the board support, a solder bump pattern provided on a board surface of the printed circuit board being brought into contact with an obverse surface of the board support at a portion clamped to electrically conduct with the board support. A portion adjacent to a portion where the solder bump pattern is formed on the printed circuit board is placed on a reference supporting surface provided in continuation from the board support and adapted to restrict a reference position of the printed circuit board. The portion is clamped to a clamping piece provided in continuation from the board support, and an obverse surface of the clamping piece is brought into pressure contact with the solder bump pattern.
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