| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a novel multilayer wiring board, which can obtain a highly integrated multilayer wiring board, in which formation of fine vias are attained between every layers. SOLUTION: In the manufacturing method includes preparing a plurality kind of fundamental wiring boards 50α, 50γ, and 50γhaving a multilayer wiring structure, in which using multilayer metal sheet; forming a wiring film on at least one surfaces of the boards; forming a wiring film or wiring film forming metal sheet on the other surfaces of the boards; conducting interlayer insulation is by an insulation film, and conducting interlayer connections by bumps made of metal; and laminating a plurality of the fundamental wiring boards 50α, 50γ, and 50γ, including different kinds of boards of the plurality of kinds of fundamental wiring boards. COPYRIGHT: (C)2006,JPO&NCIPI |
