发明名称 |
Adhesive die attachment method for a semiconductor die and arrangement for carrying out the method |
摘要 |
The invention relates to an adhesive attaching method for attaching a semiconductor die to a substrate in which an adhesive is deposited onto the substrate, the deposited adhesive is partially cured and/or dried, the partially cured and/or dried adhesive is reheated and a semiconductor die is placed onto the reheated adhesive, after which the adhesive is fully cured so that the semiconductor die is bonded, both electrically and mechanically, to the substrate.
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申请公布号 |
US6967123(B2) |
申请公布日期 |
2005.11.22 |
申请号 |
US20030370435 |
申请日期 |
2003.02.20 |
申请人 |
AGILENT TECHNOLOGIES, INC. |
发明人 |
NG KEE YEAN;SEAH KEH CHIN;LEE CHONG HAI |
分类号 |
H01L21/58;(IPC1-7):H01L21/44 |
主分类号 |
H01L21/58 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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