| 摘要 |
PROBLEM TO BE SOLVED: To provide an environmentally friendly epoxy resin composition for sealing a semiconductor by enhancing heat-cycle resistance and moisture absorption-resistant solder characteristics, and a semiconductor device made by using the composition. SOLUTION: This epoxy resin composition for sealing a semiconductor is an epoxy resin composition comprising (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator, (D) a silica-based inorganic filler, (E) a silicone rubber solid at 25°C and (F) a silicone oil liquid at 25°C, where at least either of the epoxy resin(A) and the phenol resin(B) contains a resin of a phenol-aralkyl type structure having a phenylene skeleton in the main chain, and does not contain a bromine-containing compound and an antimony-containing compound as the ingredient in the composition. COPYRIGHT: (C)2006,JPO&NCIPI
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