发明名称 |
Semiconductor device, method of manufacturing the same, cover for semiconductor device, and electronic equipment |
摘要 |
A method of manufacturing a semiconductor device includes (a) fixing a cover onto a semiconductor substrate so as to place a surface of the cover that includes a portion defining a first opening, face to face on a surface of the semiconductor substrate that includes an electrode and (b) applying an adhesive to the inside of the first opening.
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申请公布号 |
US2005255627(A1) |
申请公布日期 |
2005.11.17 |
申请号 |
US20050187081 |
申请日期 |
2005.07.22 |
申请人 |
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发明人 |
OMORI OSAMU |
分类号 |
H01L23/04;H01L27/146;H01L31/0203;H01L31/0232;(IPC1-7):H01L21/00 |
主分类号 |
H01L23/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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