| 摘要 |
PROBLEM TO BE SOLVED: To obtain a semiconductor device and its assembling process in which a heat sink can be fixed to a substrate without requiring any screw. SOLUTION: The semiconductor device comprises a substrate 14 mounting a semiconductor element 12 thereon; a heat sink 16; a plurality of pins 18 being passed through a plurality of holes of the heat sink and the substrate and having a swelling part at one end thereof; an engagement member 20 projecting from the substrate through the holes of the heat sink and the substrate and engaging with the other end of the pin 18; and a spring 22 arranged between the swelling part of the pin and the heat sink. When the semiconductor device is assembled, the pin 18 is held by a holding member 26 which is removed from the pin 18 when assembly of the semiconductor device is completed. COPYRIGHT: (C)2006,JPO&NCIPI |
