发明名称 |
Defect identification system and method for repairing killer defects in semiconductor devices |
摘要 |
A method for improving semiconductor yield by in-line repair of defects during manufacturing comprises inspecting dies on a wafer after a selected layer is formed on the dies, identifying defects in each of the dies, classifying the identified defects as killer or non-critical, for each killer defect determining an action to correct the defect, repairing the defect and returning the wafer to a next process step. Also disclosed is a method for determining an efficient repair process by dividing the die into a grid and using analysis of the grid to find a least invasive repair.
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申请公布号 |
US2005255611(A1) |
申请公布日期 |
2005.11.17 |
申请号 |
US20040911142 |
申请日期 |
2004.08.04 |
申请人 |
PATTERSON OLIVER D;SHUTTLEWORTH DAVID M;ALBERS BRADLEY J;WECK WERNER;BROWN GREGORY |
发明人 |
PATTERSON OLIVER D.;SHUTTLEWORTH DAVID M.;ALBERS BRADLEY J.;WECK WERNER;BROWN GREGORY |
分类号 |
G01R31/26;G01R31/28;H01L21/66;H01L21/768;(IPC1-7):H01L21/66 |
主分类号 |
G01R31/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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