| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To commercially provide an adhesive sheet for a semiconductor device that has excellent processibility, reflow heat resistance, and thermal cycle resistance, and also to provide a component for a semiconductor device and a semiconductor device using the same. <P>SOLUTION: The adhesive sheet for a semiconductor device comprises a light peel protection film, an adhesive layer, and a heavy peel protection film. These materials are laminated in this order. The difference in peeling force relative to the adhesive layer between the light peeling protection film and the heavy peeling protection film is 5 N/m or over, the elongation of the heavy peeling protection film in a temperature region from 60 to 130°C is 70 to 2,000%, and the peeling force of the heavy peel protection film to the adhesive layer is 3-70 N/m after it is heated by a temperature of 130°C for five minutes. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
