| 摘要 |
FIELD: microelectronics; optoelectronic integrated circuits. ^ SUBSTANCE: proposed integrated optocoupler has emitter and photodetector chips inside internal optically opaque compound and optically transparent compound that may be coated with reflecting compound and functions to afford optical coupling between chips. Optically opaque, optically transparent, and reflecting compounds based on same material doped with relevant additives form monolithic package. Proposed integrated optocoupler is characterized in monolithic multilayer package resistant to environmental factors which ensures high insulation breakdown voltage. ^ EFFECT: enhanced reliability due to high insulation breakdown voltage. ^ 1 cl, 1 dwg |
