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发明名称
Double wire bonding structure of semiconductor device
摘要
申请公布号
KR100526847(B1)
申请公布日期
2005.11.08
申请号
KR20030082356
申请日期
2003.11.19
申请人
发明人
分类号
H01L21/60
主分类号
H01L21/60
代理机构
代理人
主权项
地址
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