| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device wherein a semiconductor element is surely flip-chip-mounted on a semiconductor carrier without causing a short circuit independently of an electrode pitch, and to provide a manufacturing method thereof. <P>SOLUTION: In the semiconductor device, a semiconductor element 3 one side face of which includes a plurality of electrodes 1, and a semiconductor carrier 4 the upper side of which includes a plurality of electrodes 5 corresponding to the plurality of the electrodes 1 on the semiconductor element 3, are connected via the respective electrodes 1, 5 with a conductive adhesive 6, and a sealing resin 7 is filled in a gap between the semiconductor element 3 and the semiconductor carrier 4 and covers the circumferential edge of the semiconductor element 3. A plurality of sets of the electrodes 1, 5 are configured such that Au bumps 2a, 2b are alternately formed to sides of the semiconductor element 3 and the semiconductor carrier 4 along an electrode arrangement direction, and the plurality of sets of electrodes 1, 5 are connected with the conductive adhesive 6 supplied to the Au bumps 2a, 2b. Thus, the generation of a short circuit between the adjacent electrodes caused by wet spread of the conductive adhesive 6 can be prevented, and a sufficient amount of the conductive adhesive 6 is supplied to the electrode even when the electrode pitch of the semiconductor element 3 (and semiconductor carrier 4) is small to surely establish flip-chip connection. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
