| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive resist composition suitable for liquid immersion exposure and improved in such problems as collapse of a resist pattern due to post exposure delay between steps of exposure and PEB (post exposure bake), deterioration in the profile and production of scum during liquid immersion exposure, and to provide a method for forming a pattern by using the composition. <P>SOLUTION: The positive resist composition for liquid immersion exposure comprises: (A) a resin having a monocyclic or polycyclic alicyclic hydrocarbon structure and having the solubility with an alkali developing solution which increases by the effect of an acid; (B) a compound which generates an acid by irradiation with actinic rays or radiation; (C) a nitrogen-containing compound having no hydroxyl group; and (D) solvent. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
