| 摘要 |
<P>PROBLEM TO BE SOLVED: To maintain a sufficient distance between a semiconductor element and a wiring substrate for improving the mobility at the pouring of underfill resin. <P>SOLUTION: Gold bumps 2 formed at both a semiconductor element 1 and a wiring board 3 are jointed so that a sufficient distance between the semiconductor element 1 and the wiring board 3 is maintained. Thus, it is possible to improve the mobility of underfill resin 6, and to prevent the generation of the non-filling of the underfill resin 6. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
