| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a power module that can be replaced for the purpose of maintenance at an appropriate time, when a high cost versus effect is obtained before the occurrence of faults. <P>SOLUTION: A semiconductor device disclosed herein includes an insulation substrate, a semiconductor chip including a chip electrode mounted on the insulation substrate, a first electrode electrically connected to the chip electrode via a first metallic wire, and a second electrode electrically connected to the chip electrode via a second metallic wire. The second metallic wire is broken more easily than the first metallic wire. The time for which the probability of the occurrence of the broken first metallic wire is high can be recognized, by monitoring a voltage of the second metallic wire broken more easily than the first metallic wire electrically interconnecting the semiconductor chip and a major electrode, and by detecting the occurrence of the broken second metallic wire. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
