| 摘要 |
PROBLEM TO BE SOLVED: To provide a metallized film, namely, the metallized film for an electronic component such as a wiring circuit board wherein a thin wiring circuit board can be obtained; even when it is used for a multilayered wiring circuit board, as it is thin, no trouble is generated in designing; in addition, it is practically possible to make the width of a wiring circuit narrower than 40μm and the wiring circuit board with a high density can be easily obtained; there exists no possibility of generating any creases on a plastic film; and a plated layer such as copper with a uniform thickness can be easily obtained. SOLUTION: The metallized film for the electronic component is characterized by forming a release layer on one face of a plastic film with a thickness of 10-100μm, forming a heat-resistant and electrically insulating resin layer with a thickness of 0.5-5μm on the release layer, and forming a metal thin film layer with a thickness of 0.32-10.5μm by successively forming a metal deposited layer and a metal plated layer on the resin layer. COPYRIGHT: (C)2006,JPO&NCIPI
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