发明名称 TIN-COPPER ALLOY PLATING LIQUID
摘要 PROBLEM TO BE SOLVED: To provide a low cost tin-copper alloy plating liquid which can form a plating film having a satisfactory gloss, and reduces discoloration in the plating film after a reflow treatment. SOLUTION: The tin-copper alloy plating liquid is composed of an aqueous solution comprising stannous sulfate, copper sulfate, sulfuric acid, chloride, an aromatic carbonyl compound and a surfactant as effective components. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005307227(A) 申请公布日期 2005.11.04
申请号 JP20040122110 申请日期 2004.04.16
申请人 OKUNO CHEM IND CO LTD 发明人 OTSUKA KUNIAKI;SATO KAZUYA;KAJIMOTO HIROYUKI;NAGAO TOSHIMITSU
分类号 C25D3/60;(IPC1-7):C25D3/60 主分类号 C25D3/60
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