Methods for producing a light emitting semiconductor body with a liminescence converter element

摘要

The invention describes two methods of fabricating semiconductor components in which a luminescence conversion element is applied directly to the semiconductor body ( 1 ). In the first method, a suspension ( 4 ) containing a bonding agent and at least one luminescent material ( 5 ) is applied to the semiconductor body ( 1 ) in layers. In the next step the solvent escapes, leaving only the luminescent material ( 5 ) with the bonding agent on the semiconductor body. In the second method, the semiconductor body ( 1 ) is provided with a layer ( 6 ) of bonding agent to which the luminescent material ( 5 ) is applied directly.