| 摘要 |
PURPOSE:To prevent dust attaching, scratching, etc., and occurence of defective products in transferring patterns onto semiconductor substrates, by covering the surface of a glass mask pattern for manufacture of semiconductors with a glass plate having optional thickness and size. CONSTITUTION:An adhesive 5 is applied onto the pattern surface 3 of a reticle mask 1 to a thickness similar to a pattern 2, and a glass plate 4 same in quality as the mask 1 is stuck to obtain a desired reticle mask. As a result, trouble, such as dust attaching to the surface 3 or scratching of it, is prevented, and hence, trouble of causing defective products due to projection of dust and scratches is prevented when the pattern is transferred onto a semiconductor substrate using this mask, and yield of the product is enhanced. In addition, the management of inspection of dust and scratches on the reticle mask pattern 2 is made unnecessary. |
