| 摘要 |
PROBLEM TO BE SOLVED: To realize high density assembly capable of mounting many components as a whole including surface mount components, by incorporating components in an insulating layer. SOLUTION: In the double-sided board (1) with built-in components, an electronic component (30) with solder terminals (31a, 31b) at both ends is arranged so that in the inside of a hole (25) which penetrates an insulating layer (11), the solder terminals may be located at the both ends of the hall (25). An interlayer connection between both conductors (12, 15) is carried out via the electronic component (30), by adhering the conductors (12, 15) at the both sides of an insulating layer (11), and by performing press contact at the solder melting temperature. In a double-sided wiring board (2) with built-in components, circuit patterns (12P, 15P) are formed in the double-sided conductors (12, 15), with conductors (12a, 15a) of the both end connection part of the electronic component (30) left therein. COPYRIGHT: (C)2006,JPO&NCIPI
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