| 摘要 |
This invention concerns a transceiver module (send/receive module) for microwaves and millimeter wave applications or associated module platform concepts for interconnecting partial modules to make an overall module, which is particularly suitable for mass production. The transceiver module contains a) one or more individual electronic components, which in particular comprise active circuit components of an (preferably voltage-controlled) oscillator, a mixer and a frequency divider, and b) a substrate with a multilayer structure and integrated circuit elements, in particular a hybrid ring of the mixer and a resonant circuit of the voltage-controlled oscillator. The individual electronic components are located on the top side of the substrate. This invention makes it possible to combine the send and receive functions in a compact component with a three-dimensional integration of the high frequency components. |
