| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that it is impossible to satisfy both requests when wire bonding is used for real element detection in a floating surface processing step and solder bonding is used for connecting terminals to each other in an assembling step. SOLUTION: An MR head and a recoding head are stacked on the element forming surface 15 of a slider 10, a lead wire 70 connected to the electrode 7 of the MR head is connected through a copper stud to an MR element terminal 20, and a leading out wire 50 from the coil 5 of the recording head is connected through a copper stud to a recording element terminal 30. The laminate of the MR head and the recording head, the lead wire 70, and the coil drawer wire 50 are covered with an alumina protective film, and the MR element terminal 20 and the recording element terminal 30 are formed on the alumina protective film. Slits 40 are formed in the MR element terminal 20 and the recording element terminal 30 and divided in the height direction of the slider 10. COPYRIGHT: (C)2006,JPO&NCIPI
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