| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a passive element accommodating wiring substrate capable of being miniaturized while accommodating a passive element and easily coping with the change of a position, size or the like of the passive element, and to provide a manufacturing method for simply manufacturing such a passive element accommodating wiring substrate. <P>SOLUTION: The passive element accommodating wiring substrate is provided with a core substrate, wiring formed on the core substrate through an electric insulating layer, and a capacitor constituted so that a pair of electrodes are opposed through a thin film region of the electric insulating layer. The manufacturing method of such a passive element accommodating wiring substrate comprises a process for forming a lower electrode and wiring on the core substrate; a process for forming an electric insulation thin film so as to cover the lower electrode and the wiring; a process for forming an electric insulating layer on the electric insulating thin film so that the electric insulating thin film positioned above the lower electrode is exposed and forms the thin film region; and a process for forming an upper electrode so as to cover the thin film region to obtain a capacitor, and further, forming the wiring on the electric insulating layer. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
