Selective treatment of the surface of a microelectronic workpiece

摘要

This invention provides a process for treating a workpiece (10) having a front side (12), a back side (14), and an outer perimeter (16). In accordance with the process, a processing fluid is selectively applied or excluded from an outer peripheral margin of at least one of the front (12) or back (14) sides of the workpiece (10). Exclusion and / or application of the processing fluids occurs by applying one or more processing fluids to the workpiece (10) as the workpiece (10) and corresponding reactor (1100) are spinning about an axis of rotation (A) that is generally parallel (or antiparallel) to the vector defining the face of the workpiece (10) being processed. The flow rate of the one or more processing fluids, fluid pressure, and/or spin rate are used to control the extent to which the processing fluid is selectively applied or excluded from the outer peripheral margin.