发明名称 Heatsink mounting unit
摘要 A heatsink mounting unit prevents a heatsink cooling an electronic device mounted on a printed circuit board from a breakaway. The heatsink mounting unit includes a flat spring having a first end part formed with a combining arm combined to the printed circuit board by a fastening device and a second end part having a hook. The flat spring elastically presses the heatsink against the printed circuit board. The heatsink mounting unit also includes a hook holding member combined to the printed circuit board and having a hook hole to which the hook is hooked. Thus, the present invention provides a heatsink mounting unit which is easily mounted and effectively prevents a heatsink from a breakaway.
申请公布号 US6958913(B2) 申请公布日期 2005.10.25
申请号 US20020298615 申请日期 2002.11.19
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KOO KYUNG-HA
分类号 H01L23/40;(IPC1-7):H05K7/20 主分类号 H01L23/40
代理机构 代理人
主权项
地址