发明名称 ELECTROLYTIC COPPER FOIL WITH CARRIER FOIL AND METHOD FOR MANUFACTURING THE SAME AND COPPER-CLAD LAMINATED SHEET USING ELECTROLYTIC COPPER FOIL WITH CARRIER FOIL
摘要 PROBLEM TO BE SOLVED: To provide an electrolytic copper foil with a carrier foil which can be used in a press molding temperature region at 230°C or lower and uses an organic agent in a bonding interface layer. SOLUTION: The electrolytic copper foil 1a with the carrier foil is equipped with the bonding interface layer 2 on one face of the carrier foil C, and is equipped with an electrolytic copper foil layer CF on the bonding interface layer 2. The bonding interface layer 2 is formed by using a solution containing triazine thiols. The triazine thiols here is especially preferably 2-anilino-4,6-dimercapto-s-triazine. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005288856(A) 申请公布日期 2005.10.20
申请号 JP20040106678 申请日期 2004.03.31
申请人 MITSUI MINING & SMELTING CO LTD 发明人 TAKAHASHI MASARU;DOBASHI MAKOTO
分类号 B32B15/01;C25D1/22;C25D5/12;C25D7/06;(IPC1-7):B32B15/01 主分类号 B32B15/01
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