| 摘要 |
A chassis air guide thermal cooling solution including a fan to which protruding edges are wedged at wedge grooves of a locating assembly to locate the fan therein, locating notches of a flexible ring are positioned in the locating assembly, an accommodating ring is accommodated around the flexible ring, and the locating assembly is fastened with a locating plate by means of screws; a side panel is devised with ventilation openings for drawing external air or discharging hot air at the interior of the device. The locating assembly is provided with a plurality of flexible openings, and after having fixed the locating plate therein, an assembled position of the chassis air guide thermal cooling solution is adjusted; after having assembled the chassis air guide thermal cooling solution therein, a distance between the accommodating ring and the heat dissipating fan is adjusted using the flexible ring.
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