Semiconductor chip, has connection contacts electrically connected with its surfaces at back side or top side of redistribution layer utilizing press contacts, where layer is located on main side

摘要

The chip (1) has a component whose connection contacts (5) are located on a main side of a body of the chip. The connection contacts are electrically connected with its surfaces at a back side or a top side of a redistribution layer using a press contact, where the layer is located on the main side. A conducting strip is provided between one end of the press contact and the contact surfaces.